Siphenya ngokufaneleka kwekhredithi yomhlinzeki, ukulawula ikhwalithi kusukela ekuqaleni. Sineqembu lethu le-QC, singakwazi ukuqapha nokulawula ikhwalithi phakathi nenqubo yonke kufaka phakathi ukuza, ukugcina, nokudiliva.Zonke izingxenye ngaphambi kokuthunyelwa zizodluliselwa kuMnyango wethu we-QC, sinikeza iwaranti engu-1 yonyaka kuzo zonke izingxenye esinikezile.
Ukuhlolwa kwethu kuhlanganisa:
- Ukuhlolwa Okubukwayo
- Imisebenzi yokuhlola
- X-Ray
- Ukuhlolwa kwe-Solderability
- Ukuchithwa kwe-Die Verification
Ukuhlolwa Okubukwayo
Ukusetshenziswa kwe-microscope stereoscopic, ukubukeka kwezingxenye ze-observation 360 ° nxazonke. Ukugxila kwesimo sokubuka kubandakanya ukufakelwa komkhiqizo; uhlobo lwe-chip, usuku, i-batch; isimo sokunyathelisa nesiphakamiso; ukuhlelwa kwephini, i-coplanar ne-plating yecala njalo njalo.
Ukuhlolwa okubukwayo kungakwazi ukuqonda ngokushesha imfuneko yokuhlangabezana nezidingo zangaphandle zabakhiqizi bemikhiqizo yasekuqaleni, amazinga anqabelayo nesimo somswakama, nokuthi ngabe asetshenzisiwe noma avuselelwe yini.
Imisebenzi yokuhlola
Yonke imisebenzi nemigomo evivinywe, ebizwa ngokuthi ukuhlolwa okusebenza ngokugcwele, ngokusho kokucaciswa kwasekuqaleni, amanothi okufaka isicelo, noma isayithi lesicelo lesiklayenti, ukusebenza okugcwele kwamadivayisi ahlolwe, kufaka phakathi imingcele ye-test, kodwa ayifaki isici se-parameter ye-AC ukuhlaziywa kanye nokuqinisekiswa kwengxenye ye-test non-bulk imingcele yemingcele.
X-Ray
Ukuhlolwa kwe-X-ray, ukuhamba kwezingxenye ezingaphakathi kwe-360 ° nxazonke, ukubona isakhiwo sangaphakathi sezingxenye ngaphansi kokuhlolwa nesimo sokuxhumeka kwephakheji, ungabona inombolo enkulu yamasampula ngaphansi kokuhlolwa okufanayo, noma ingxube (Okuxubile-Up) izinkinga ziphakama; ngaphezu kwalokho banezincazelo (Datasheet) komunye nomunye kunokuqonda ukufaneleka kwesampuli ngaphansi kokuhlolwa. Isimo sokuxhumeka kwephakheji yokuhlola, ukuze ufunde mayelana nokuhlanganiswa kwe-chip nephakheji phakathi kwezikhonkwane kuvamile, ukukhipha ukhiye nokuvula ucingo olufushane.
Ukuhlolwa kwe-Solderability
Lena akuyona indlela yokubona engalungile njengoba i-oxidation kwenzeka ngokwemvelo; Kodwa-ke, kuyinkinga ephawulekayo yokusebenza kanti ikakhulukazi ezindaweni ezifudumele, ezinomdumo ezifana ne-Southeast Asia kanye nezwe eliseningizimu eNyakatho Melika. Izinga elihlangene J-STD-002 lichaza izindlela zokuhlola futhi zamukela izindlela zokunquma / ukulahla / ukulahla / ukulahla izinkomba ze-hole, indawo ye-surface, namadivayisi we-BGA. Ngamadivaysi angaphandle angaphandle kwe-BGA, i-dip-and-look iqashwe futhi "ukuhlolwa kweplani ye-ceramic" yamadivaysi e-BGA kusanda kufakwa kuhlelo lwethu lwezinsizakalo. Amadivaysi athunyelwa emaphaketheni angalungile, amaphakheji amukelekile kodwa angaphezu konyaka owodwa ubudala, noma abonise ukungcoliswa kwezikhonkwane kunconywa ukuhlolwa kwe-solderability.
Ukuchithwa kwe-Die Verification
Uhlolo olubhubhisa olususa ukwaziswa okugxilwe kwento ukuze kuvezwe ukufa. Khona-ke ukufa kuhlaziywa ngokumaka kanye nezakhiwo zokwakha ukucacisa ukulandelela nokuthembeka kwedivayisi. Amandla okugaya afinyelele ku-1,000x kuyadingeka ukuze abone ukufa nokuphazamiseka okuphezulu.